Session 1 | Alex Wang (ASE) | Semiconductor Package Design Solution For High Density Fan-Out Packaging | 5 min from 5g connection router Watch Video
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Description: Alex Wang | Managern----------------nThere is great need for multi-die packaging – Chipletes & SiP – to meet the needs of High Performance Computing for Data Ceteers, 5G, Accelerators, AI & ML, & Autonomous Driving applicatiopns and more. A good example of the package type used in such high-performance computing product mass production is Silicon Interposer IC package with ultra-high density I/O, for high performance GPU, and high-speed networking devices, Between the ASIC chip a
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